Processor Thermal Paste CPU Conductive Paste Grease PC Heat-sink Cooling Cooler Cream Heatsink Plaster ND998 (as show China)

CPU Processor Thermal Conductive Paste Grease PC Heat-sink Cooling Cream ND998

Description:

Feature:
It is 1g Gold thermal compound which has with 3.8W/mK a very high thermal conductivity and is therefore good for nearly all cooling applications.
The compound will be delivered in a Syringe and can be easily used for dispensing the Paste in thin layers between Processor and Heat Sink and normally is sufficient for 3 – 10 uses.

Specification:
Thermal Conductivity: > 3.8 W/m*K
Thermal Impedance: < 0.087 degC- in²/W
Specific Gravity: > 2.5
Thixotropic Index: 380 +/-10  
Working Temperature: -50 -340degC

Type:

Thermal Grease

 

Package Includes:

1 x Thermal Conductive Grease